2021 FINETECH PICO ma/rs Multi purpose bonder & High Density Rework station with motorized Z axis placement and 5um accuracy

Multi-purpose Die Bonder The FINEPLACER® pico ma is a cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.Finetech PICO configured for bonding optical lens assemblies used in LIDAR This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.  Highlights - Placement accuracy 5 µm - Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm- Working area up to 450 mm x 234 mm- Motorized Z axis placement- Supports wafer/substrate sizes up to 200 mm- Supports bonding forces up to 700 N

Manufacture date June 2021.  Original cost over 120k

configuration:

PICO base system with manual zoom camera and USB and LED illumination

Integration of 2nd vaccum circuit

Optics shifting 85mm, crank handled

Target finder

LED coaxial illumination for chip and substrate

Placement arm including theta rotation

Adjustment set, 5um for placement arm with fine rotation

WinFlipChip software and PC

Y-camera shifting

Process video module

Height adjustable tracks for positioning table

Bonding force module, automatic

UV curing option for FINEPLACER lambda, pico, micro

Placement head with gimbal for chip 18.2x16.6x0.95

Eccentric tool holder

Vacuum plate 220x120 with holder for tray and UV station

Micron adjustable arm stop in lower arm position

Full manual included

sn P213069